Customization: | Available |
---|---|
After-sales Service: | on Site Installation |
Type: | Solder Paste Printer |
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performance | |
Machine Alignment Capability | 2 Cmk @ ± 10 microns 6 sigma |
Process Alignment Capability | 2 Cpk @ ± 18 microns 6 sigma |
Core Cycle Time (excluding printing & cleaning time) |
< 8.5 secs |
Product Changeover Time | < 3 mins |
New Product Set-up Time | < 10 mins |
board handling | |
Max. Size (L x W) | 510 mm x 510 mm |
Min. Size (L x W) | 50 mm x 50 mm |
Thickness | 0.4~6 mm |
PCB Thickness Adjustment | Automatic |
PCB Max. Weight | 5 kg |
PCB Edge Clearance | 3 mm |
PCB Bottom Clearance | 23 mm |
PCB Warpage | Max. 1% diagonally |
Clamping Method | Auto retractable top clamp, motor controlled side clamp |
Support Method | Magnetic support pins, bars, blocks, vacuum suction |
Conveyor Direction | L to R, R to L, R to R, L to L (software control) |
Conveyor Height | 900 ± 40 mm |
Conveyor Speed | 1,500 mm/s |
Conveyor Width Adjustment | Automatic |
printing parameters | |
Stencil Frame Size (L x W) | Adjustable, 470 mm x 370 mm to 737 mm x 737 mm |
Print Gap (snap-off) | 0~20 mm |
Printing Table Adjustment Range | X: ±10 mm, Y: ±10 mm : ± 2° |
Print Speed | 10~200 mm/s |
Squeegee Pressure | 0.5~10kg (program control) |
Squeegee Type | Std.: OPC Squeegee 300 mm, 450 mm & Metal Squeegee 520mm. Option: Rubber |
Squeegee Angle | Std. 60°, Option 45°, 50°, 55° |
Cleaning System | Auto wet, dry, vacuum (Software select) |
facilities requirement | |
Power Supply | AC220V ± 10% 50/60Hz |
Power Consumption | 3kW |
Air Supply | 4 ~ 6Kgf/cm² |
Air Consumption | 5L/min |
Dimension (excluding signal tower) | 1,240 mm (L) x 1,560 mm (W) x 1,490 mm (H) |
Machine Weight | 1,200kg |
operator interface | |
Hardware | LCD Monitor, Mouse & Keyboard |
Operating System (OS) | Windows 10 |
Control Method | Industrial PC controlled |
I/O Interface | SMEMA Standard |
optical system | |
Field-of-View (FOV) | 10mm x 8mm |
Fiducial Types | Circle, triangle, square, diamond, cross |
Fiducial Size | 0.5~4.0 mm |
Vision Methodology | Digital CCD camera look up & down |
2D Inspection | Max.100 windows to inspect missing & insufficient (std.) |
Standard Features | OPTIONS |
Auto paste replenishment (OPC) | SPI closed-loop |
Paste rolling diameter monitoring system (OPC) | Auto glue dispensing |
OPC squeegee assembly (2 pairs 300mm & 450mm) | Temperature, humidity monitoring & display with aircon unit |
Stencil Lock (QPC) | Internal/External barcode scanner for PCB traceability |
Stencil apertures inspection system (QPC) | Handheld barcode scanner for stencil, solder paste, squeegee traceability |
MES system integration (For Ind. 4.0) | |
2 machines in series for higher output | |
2 machines back to back for dual lane SMT line |